1.5*14*15 Heat conducting AlN aluminum nitride ceramic substrate for LED gasket
Aluminum nitride ceramic substrate thermal conductive performance is very good, is the field of thermal conductivity of thermal conductivity performance is one of the best material, has excellent thermal conductivity aluminum nitride ceramics (7-10 times of alumina ceramics), low dielectric constant and dielectric loss, reliable insulation performance, good mechanical performance, non-toxic, high temperature resistance, resistance to chemical corrosion, and close to the thermal expansion coefficient of silicon, as a new generation of ceramic material, more and more get the attention of people and attention.
aln substrate Performance index
1.The thermal conductivity is high ( about 320W / m · K ) , close to BeO and SiC , it is more than 5 times of Al2O3 , and the thermal expansion coefficient ( 4.5 × 10 - 6 ℃ ) of
2.Matches with Si ( 3.5 -4 × 10 - 6 ℃ ) and GaAs ( 6 × 10 - 6 ℃ ) .
3.All kinds of electrical properties (dielectric constant, dielectric loss, body resistivity, dielectric strength) are excellent.
4.The flexural strength is higher than that of Al2O3 and BeO ceramics and can be sintered under atmospheric pressure.5.Good optical transmission characteristics;6.Non-poisonous
The product application
1 hybrid integrated circuit interconnection substrate,
2. Microwave devices,
3. Photoelectric communication,
6. Photoelectric device substrate,
7. Ceramic carrier,
8 laser carrier,
9. Chip capacitor,
10 x refers to capacitance and spiral inductance, etc.